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Philips is testing the technology’s capability in novel LED applications.
October 26, 2015
By: DAVID SAVASTANO
Editor, Ink World Magazine
At the Meeting of the International Microelectronics Assembly and Packaging Society (IMAPS 2015), imec and CMST (imec’s associated lab at Ghent University) presented a novel technology for thermoplastically deformable electronics enabling low-cost 2.5D free-form rigid electronic objects. The technology is under evaluation in Philips LED lamp carriers, a downlight luminaire and a omnidirectional lightsource, to demonstrate the potential of this technology in innovative lighting applications. ...
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